One of the physical vapor deposition technology
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What is sputtering in chemical coating?
It uses ionized gas to ablate (鈥渟putter鈥? a target to create a thin film of that material on a substrate. Because there is no requirement for either the coating or substrate material to be electrically conductive, sputtering can be used to deposit coatings of very high chemical purity onto essentially any substrate.
What are the advantages and disadvantages of sputter coating?
Sputter deposition, as a relatively common physical vapor deposition (PVD) method, has its advantages, such as a wide range of deposition materials and high coating quality. The table below details the advantages and disadvantages of sputter coating. It is provided by Stanford Advanced Materials and is for informational purposes only.
What is the best sputter coating material?
Historically, the most frequently used sputter coating material has been gold because of its high conductivity and relatively small grain size, which makes it ideal for high-resolution imaging.
What is sputtering in vapor deposition?
Sputtering is a versatile form of physical vapor deposition which can be used to deposit coatings of conductive or insulating materials. It uses ionized gas to ablate (鈥渟putter鈥? a target to create a thin film of that material on a substrate.