One of the physical vapor deposition technology
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What is sputtering in chemical coating?
It uses ionized gas to ablate (鈥渟putter鈥? a target to create a thin film of that material on a substrate. Because there is no requirement for either the coating or substrate material to be electrically conductive, sputtering can be used to deposit coatings of very high chemical purity onto essentially any substrate.
What are the advantages and disadvantages of sputter coating?
Sputter deposition, as a relatively common physical vapor deposition (PVD) method, has its advantages, such as a wide range of deposition materials and high coating quality. The table below details the advantages and disadvantages of sputter coating. It is provided by Stanford Advanced Materials and is for informational purposes only.
What is the best material for sputter coating?
Historically, the most used sputter coating material has been gold, due to its high conductivity and its relatively small grain size that enables high-resolution imaging. Also, if EDX analysis is required, SEM users typically coat their samples with carbon because carbon鈥檚 X-ray peak does not conflict with the peak of any other element.
What is sputtering deposition technology?
Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces.